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  1. NEXX Systems: A semiconductor process equipment company focused on flip chip and advanced wafer level packaging technology.

    NEXX Systems develops and manufactures the Nimbus, Stratus, and Cirrus systems. ? Nimbus is a high throughput, low cost-of-ownership sputter deposition system ...
    flip chip advanced packaging0
    redistribution layers0
    under bump metallization0

    www.nexxsystems.com - 2009-02-06

flip-chip1 fold-over1 bonding2 flip chip1 process control2 crowns2 dentist3 assembly2 mems1 etch1 bga1 fine pitch bga1 pcb2 nano2 bridges2 integrated passives1 ubm1 nanotechnology2 land grid array1 jvx 6200i1 csp1 micro2

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